Description

Cellecta HiDECK 18: The Ideal Underfloor Heating Overlay Board

Experience the superior efficiency of the Cellecta HiDECK 18 Board, a game-changer in underfloor heating systems. With its low thermal resistance and rapid heat transfer characteristics, the HiDECK 18 enhances the performance of your heating system, ensuring a warm and comfortable environment.

The unique design of the HiDECK 18 eliminates the need for screws, thanks to its innovative tongue and groove structure. But that’s not all. The HiDECK 18 comes with a plethora of benefits that set it apart:

• Rapid Heat Transfer: Low thermal resistance (0.045m²/kW) and high conductivity for faster, more efficient heating.
• Easy, Screw-Free Installation: Tongue and groove design saves you time and hassle.
• Durable & Waterproof: Won't expand/contract like chipboard, ideal for wet areas.
• Perfect for Tiling: Accepts ceramic tiles directly for a seamless finish.
• Thin & Impact Resistant: Minimizes floor buildup while offering high strength.

Technical Specifications:

• Thickness: 18mm
• Thermal Conductivity: 0.40W/mK
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Experience the difference with Cellecta HiDECK 18

IF A TAIL LIFT OR MOFFETT IS REQUIRED PLEASE CONTACT US